View TDA8793_239989.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

INTEGRATED CIRCUITS
DATA SHEET
TDA8793 8-bit, low-power, 3 V, 100 Msps Analog-to-Digital Converter (ADC)
Product specification Supersedes data of 1999 Oct 06 File under Integrated Circuits, IC02 2000 Nov 20
Philips Semiconductors
Product specification
8-bit, low-power, 3 V, 100 Msps Analog-to-Digital Converter (ADC)
FEATURES * 8-bit low-power ADC: 180 mW (typical value) * 2.7 to 3.6 V operation * Track-and-hold circuit * In track-and-hold mode: sampling rate from 70 to 100 Msps * In non track-and-hold mode: sampling rate from 1 sps to 100 Msps * CMOS/TTL compatible digital inputs and outputs * Internal reference voltages * Adjustable full-scale range possibility with external reference * Power-down mode: 5 mW. APPLICATIONS * Radio communications * Digital data storage read channels * Medical imaging * Digital instrumentation. QUICK REFERENCE DATA SYMBOL VCCA VCCD VCCO ICCA ICCD ICCO INL DNL fCLK(max) Ptot PARAMETER analog supply voltage digital supply voltage output stages supply voltage analog supply current digital supply current output stages supply current integral non-linearity differential non-linearity maximum clock input frequency total power dissipation VCC = 3 V operating standby operating standby ramp input ramp input; fCLK = 2 MHz; VCCA = VCCD = 3 V ramp input; fCLK = 2 MHz; VCCA = VCCD = 3 V CONDITIONS MIN. 2.7 2.7 2.7 32 0 12 0 - - - 100 - TYP. 3.0 3.0 3.0 40 2 16 0.66 4 GENERAL DESCRIPTION
TDA8793
The TDA8793 is an 8-bit low-power Analog-to-Digital Converter (ADC) which includes a track-and-hold circuit and internal references. The device converts an analog input signal, up to 100 MHz, into 8-bit binary codes at a maximum sample rate of 100 Msps. All digital inputs and outputs are CMOS/TTL compatible. A sine wave clock input signal can also be used. The Power-down mode enables the device power consumption to be reduced to 5 mW.
MAX. 3.6 3.6 3.6 48 100 24 1.1 6.5
UNIT V V V mA A mA mA mA
0.85 1.70 LSB 0.25 0.80 LSB - 180 - - MHz mW
ORDERING INFORMATION TYPE NUMBER TDA8793HL PACKAGE NAME LQFP32 DESCRIPTION plastic low profile quad flat package; 32 leads; body 5 x 5 x 1.4 mm VERSION SOT401-1
2000 Nov 20
2
Philips Semiconductors
Product specification
8-bit, low-power, 3 V, 100 Msps Analog-to-Digital Converter (ADC)
BLOCK DIAGRAM
TDA8793
handbook, full pagewidth
TEN 12
VCCA 7
VCCD 10
VCCO2 22
VCCO1 20 26 25 24 D7 D6 D5 D4 D3 D2 D1 D0 CLK
INP INN
4 3 TRACK-ANDHOLD ADC LATCHES CMOS OUTPUTS
23 18 17 16 15 11
REFOUT REFIN
5 2 CLOCK DRIVER
SDN
32
REFERENCE VOLTAGES
TDA8793
STDBY
8 31 DEC 6 AGND 9 DGND 19 OGND1 21 OGND2
MGR016
Fig.1 Block diagram.
2000 Nov 20
3
Philips Semiconductors
Product specification
8-bit, low-power, 3 V, 100 Msps Analog-to-Digital Converter (ADC)
PINNING SYMBOL n.c. REFIN INN INP REFOUT AGND VCCA STDBY DGND VCCD CLK TEN n.c. n.c. D0 D1 PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 DESCRIPTION not connected reference input for ADC negative input positive input reference output for AC coupling of input analog ground analog supply voltage standby mode input digital ground digital supply voltage clock input track enable input (active LOW) not connected not connected data output bit 0 (LSB) data output bit 1 SYMBOL D2 D3 OGND1 VCCO1 OGND2 VCCO2 D4 D5 D6 D7 n.c. n.c. n.c. n.c. DEC SDN PIN 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
TDA8793
DESCRIPTION data output bit 2 data output bit 3 output ground 1 output supply voltage 1 output ground 2 output supply voltage 2 data output bit 4 data output bit 5 data output bit 6 data output bit 7 (MSB) not connected not connected not connected not connected decoupling stabilized decoupling node output
30 n.c.
27 n.c.
29 n.c.
28 n.c.
n.c. REFIN INN INP REFOUT AGND VCCA STDBY
1 2 3 4
25 D6
26 D7
handbook, full pagewidth
32 SDN
31 DEC
24 D5 23 D4 22 VCCO2 21 OGND2
TDA8793
5 6 7 8 20 VCCO1 19 OGND1 18 D3 17 D2
VCCD 10
CLK 11
TEN 12
n.c. 13
n.c. 14
D0 15
D1 16
9
DGND
MGR017
Fig.2 Pin configuration.
2000 Nov 20
4
Philips Semiconductors
Product specification
8-bit, low-power, 3 V, 100 Msps Analog-to-Digital Converter (ADC)
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VCCA VCCD VCCO VCC PARAMETER analog supply voltage digital supply voltage output stages supply voltage supply voltage differences between VCCA and VCCD VCCO and VCCD VCCA and VCCO Vn voltage on pins INP, INN, CLK, TEN and STDBY REFIN IO Tstg Tamb Notes output current storage temperature ambient temperature note 2 -0.3 -0.3 - -55 0 +4.5 +4.5 10 -1.0 -1.0 -1.0 +1.0 +1.0 +1.0 note 1 note 1 note 1 CONDITIONS MIN. -0.3 -0.3 -0.3
TDA8793
MAX. +5.0 +5.0 +5.0 V V V V V V V V
UNIT
mA C C
+150 70
1. The supply voltages VCCA, VCCD, VCCO may have any value between -0.3 and +5.0 V provided that the supply voltage differences VCC are respected. 2. All voltages are typical values and are referenced to all ground pins connected together. HANDLING Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling integrated circuits. THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER thermal resistance from junction to ambient CONDITIONS in free air VALUE 94 UNIT K/W
2000 Nov 20
5
Philips Semiconductors
Product specification
8-bit, low-power, 3 V, 100 Msps Analog-to-Digital Converter (ADC)
TDA8793
CHARACTERISTICS VCCA = V7 to V6 = 2.7 to 3.6 V; VCCD = V10 to V9 = 2.7 to 3.6 V; VCCO = V20 to V19 and V22 to V21 = 2.7 to 3.6 V; AGND, DGND and OGND shorted together; VCCA to VCCD = -0.15 to +0.15 V; VCCD to VCCO = -0.15 to +0.15 V; VCCA to VCCO = -0.15 to +0.15 V; Tamb = 0 to 70 C; typical values measured at VCCA = VCCD = VCCO = 3.0 V and Tamb = 25 C; single-ended input; unless otherwise specified. SYMBOL Supplies VCCA VCCD VCCO ICCA ICCD ICCO analog supply voltage digital supply voltage output stages supply voltage analog supply current digital supply current output stages supply current ramp input fi = 20 MHz Internal reference voltage output (pin SDN); note 1 Vref Vreg TC IL Vref Vreg TC IL VIL VIH IIL IIH Zi Ci VIL VIH IIL IIH VIL VIH IIL IIH reference voltage line regulation voltage temperature coefficient load current 2.7 < VCCA < 3.6 V 1.21 - - -1 1.76 2.7 < VCCA < 3.6 V - - -1 0 2 VCLK = 0 VCLK = VCCD fCLK = 100 MHz fCLK = 100 MHz -2 - - - 0 2 VSTDBY = 0 VSTDBY = VCCD -5 - 0 2 VTEN = 0 VTEN = VCCD 6 -5 - 1.26 1.25 20 - 1.84 1.5 20 - - - - - 32 2 - - - - - - - - 1.31 4 - - 1.92 5 - - 0.8 VCCD +2 5 - - 0.8 VCCD - 5 V mV ppm/K mA 2.7 2.7 2.7 32 12 - - 3.0 3.0 3.0 40 16 4 8.7 3.6 3.6 3.6 48 24 6.5 12 V V V mA mA mA mA PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Internal reference voltage output (pin REFOUT) reference voltage line regulation voltage temperature coefficient load current V mV ppm/K mA
Clock input (pin CLK); note 2 LOW-level input voltage HIGH-level input voltage LOW-level input current HIGH-level input current input impedance input capacitance V V A A k pF
Standby input (pin STDBY); see Table 1 LOW-level input voltage HIGH-level input voltage LOW-level input current HIGH-level input current V V A A V V A A
Track enable input (pin TEN); see Table 2 LOW-level input voltage HIGH-level input voltage LOW-level input current HIGH-level input current 0.8 VCCD - 5
2000 Nov 20
Philips Semiconductors
Product specification
8-bit, low-power, 3 V, 100 Msps Analog-to-Digital Converter (ADC)
SYMBOL PARAMETER CONDITIONS Vi = VINP - VINN; Tamb = 25 C MIN. TYP.
TDA8793
MAX.
UNIT
Analog inputs (pins INP and INN); input voltage referenced to AGND; VREFIN = 1.27 V; see Table 3 Vi(p-p) Vi(T) VIO Zi Ci II input voltage range (peak-to-peak value) input voltage range variation with temperature input offset voltage input impedance input capacitance input current output code = 127 fi = 50 MHz fi = 50 MHz VI = VREFOUT - 0.5 V VI = VREFOUT + 0.5 V Adjustable full-scale range Vi(p-p) input voltage range (peak-to-peak value) Vi = VINP - VINN; VREFIN = 1.27 V; Tamb = 25 C; see Fig.3 - 1 - V 0.90 - -30 - - -1 - 0.95 0.5 - 90 2 - - 1.02 - +30 - - - 40 V mV/K mV k pF A A
Reference input for ADC (pin REFIN); referenced to AGND; note 3 VREFIN IREFIN VOL VOH CL V/t INL DNL S/N reference input voltage reference input current 1.25 - IO = 1 mA IO = 0.6 mA HIGH-level output voltage load capacitance slew rate 20% to 80%; CL = 10 pF ramp input; fCLK = 2 MHz; VCCA = VCCD = 3 V ramp input; fCLK = 2 MHz; VCCA = VCCD = 3 V without harmonics; fCLK = 100 MHz: fi = 20 MHz fi = 50 MHz B THD Hfund(FS) -3 dB analog bandwidth total harmonic distortion fundamental harmonics (full-scale) track-and-hold active fi = 20 MHz fi = 50 MHz fCLK = 100 MHz: fi = 20 MHz fi = 50 MHz - - - - 0 0 dB dB 43 - - - - 48 47 350 -53 -51 - - - - - dB dB MHz dB dB IO = -0.4 mA - - - - - - 1.27 0.9 - - - 1.6 0.85 0.25 1.35 1.1 V mA
ADC data outputs (pins D0 to D7) LOW-level output voltage 0.54 0.40 VCCO 10 - 1.70 0.80 V V V pF V/ns
VCCO - 0.5 -
Analog signal processing; see Figs 4, 5, 6 and 7; note 3 integral non-linearity differential non-linearity signal-to-noise ratio (full-scale) LSB LSB
2000 Nov 20
7
Philips Semiconductors
Product specification
8-bit, low-power, 3 V, 100 Msps Analog-to-Digital Converter (ADC)
SYMBOL HD2(FS) PARAMETER second harmonic distortion (full-scale) all components included CONDITIONS differential input; fCLK = 100 MHz: fi = 20 MHz fi = 50 MHz single-ended input; fCLK = 100 MHz: fi = 20 MHz fi = 50 MHz HD3(FS) third harmonic distortion (full-scale) all components included differential input; fCLK = 100 MHz: fi = 20 MHz fi = 50 MHz single-ended input; fCLK = 100 MHz: fi = 20 MHz fi = 50 MHz SFDR spurious free dynamic range fCLK = 100 MHz: fi = 20 MHz fi = 50 MHz EB effective number of bits fCLK = 100 MHz; note 4: fi = 20 MHz fi = 50 MHz track-and-hold inactive Data timing; fCLK = 100 MHz; CL = 10 pF; see Fig.8; note 2 fCLK(min) fCLK(max) tW(CLKH) tW(CLKL) tr tf tds th td Notes minimum clock frequency maximum clock frequency clock pulse width HIGH clock pulse width LOW clock rise time clock fall time sampling delay output hold time output delay time track-and-hold active IO = 0.6 mA - 100 4 4 0.75 0.75 - 3 - - - - - - - - - 6 7.0 - - 7.4 7.3 7.4 - - - - - 56 54 - - - - -59 -55 - - - - -62 -55 - - - - -57 -55 - - - - -63 -63 - - MIN. TYP.
TDA8793
MAX.
UNIT
dB dB
dB dB
dB dB
dB dB dB dB bits bits bits
70 - - - 4 4 1.5 - 8
MHz MHz ns ns ns ns ns ns ns
1. The reference output voltage (pin SDN) can be used to drive other analog circuits under the limits indicated. 2. In addition to a good layout of the digital and analog grounds, it is recommended that the rise and fall times of the clock must be more than 0.75 ns. 3. It is possible with an external reference voltage connected to pin REFIN to adjust the ADC input range. The input range variation will be fixed. 4. Effective bits are obtained via a Fast Fourier Transform (FFT) treatment taking 8000 acquisition points per equivalent fundamental period. The calculation takes into account all harmonics and noise up to half of the clock frequency (Nyquist frequency). Conversion to signal-to-noise ratio: SINAD = 6.02 x EB + 1.76 dB. 2000 Nov 20 8
Philips Semiconductors
Product specification
8-bit, low-power, 3 V, 100 Msps Analog-to-Digital Converter (ADC)
Table 1 Standby selection PIN STDBY LOW HIGH Table 2 Track-and-hold selection PIN TEN LOW HIGH Table 3 TRACK-AND-HOLD active inactive POWER-DOWN MODE inactive active D0 TO D7 output operating output logic state LOW
TDA8793
ICCA + ICCD 56 mA 0.7 mA
Output coding and input voltage (typical values; referenced to AGND; VREFIN = 1.27 V) OUTPUT CODING BITS VINP (V) <1.6 1.6 ... ... 1.85 ... ... 2.1 >2.1 VINN (V) >2.1 2.1 ... ... 1.85 ... ... 1.6 <1.6
STEP Underflow 0 1 ... 127 ... 254 255 Overflow
D7 0 0 0 ... ... ... 1 1 1
D6 0 0 0 ... ... ... 1 1 1
D5 0 0 0 ... ... ... 1 1 1
D4 0 0 0 ... ... ... 1 1 1
D3 0 0 0 ... ... ... 1 1 1
D2 0 0 0 ... ... ... 1 1 1
D1 0 0 0 ... ... ... 1 1 1
D0 0 0 1 ... ... ... 0 1 1
2000 Nov 20
9
Philips Semiconductors
Product specification
8-bit, low-power, 3 V, 100 Msps Analog-to-Digital Converter (ADC)
TDA8793
handbook, halfpage
1.4
FCE421
handbook, halfpage
67
FCE423
Vi(p-p) (V) 1.2
SFDR S/N (dB)
(1)
62
57 1 52
(2)
0.8 47
0.6 1.15
1.25
1.35
1.45 VREFIN (V)
42 1.15
1.25
1.35
1.45 VREFIN (V)
Typical values measured at VCCA = VCCD = VCCO = 3.0 V, fCLK = 100 MHz, Tamb = 25 C and single-ended input.
Typical values measured at VCCA = VCCD = VCCO = 3.0 V, fCLK = 100 MHz, Tamb = 25 C and single-ended input. (1) SFDR. (2) S/N.
Fig.3
ADC input voltage range as a function of reference input voltage.
Fig.4
Spurious free dynamic range and noise as a function of reference input voltage.
handbook, halfpage
55
FCE419
THD S/N (dB)
handbook, halfpage
(1)
8
FCE420
EB (bits) 7.5
53
(2)
(1)
(2)
51
7
49
(3)
6.5
47
6
45 1 10 fi (MHz)
102
5.5 1 10 fi (MHz)
102
Typical values measured at VCCA = VCCD = VCCO = 3.0 V, fCLK = 100 MHz and Tamb = 25 C. (1) THD differential inputs. (2) THD single-ended input. (3) S/N.
Typical values measured at VCCA = VCCD = VCCO = 3.0 V, fCLK = 100 MHz and Tamb = 25 C. (1) Differential inputs. (2) Single-ended input.
Fig.5
Distortion and noise as a function of the input frequency.
Fig.6
Effective number of bits as a function of the input frequency.
2000 Nov 20
10
Philips Semiconductors
Product specification
8-bit, low-power, 3 V, 100 Msps Analog-to-Digital Converter (ADC)
TDA8793
handbook, halfpage
8
FCE422
EB (bits) 7
6
5 1.15
1.25
1.35
VREFIN (V)
1.45
Typical values measured at VCCA = VCCD = VCCO = 3.0 V, fCLK = 100 MHz, Tamb = 25 C and single-ended input.
Fig.7
Effective bits as a function of reference input voltage.
tW(CLKL)
handbook, full pagewidth
tW(CLKH)
CLK sample N + 1 sample N + 2
sample N
Vl
tds data D0 to D7 DATA N-2 DATA N-1 td
th
DATA N
DATA N+1
MGR018
Fig.8 Timing diagram.
2000 Nov 20
11
Philips Semiconductors
Product specification
8-bit, low-power, 3 V, 100 Msps Analog-to-Digital Converter (ADC)
APPLICATION INFORMATION
TDA8793
handbook, full pagewidth
100 nF SND 100 nF 10 nF 220 nF input 50 50 REFOUT 100 nF
MGR019
DEC 31
REFIN INN INP
32 2 3 4
TDA8793
5
Fig.9 Application diagram for single-ended input mode with internal reference.
handbook, full pagewidth
EXTERNAL REFERENCE 1.25 V 100 nF 10 nF 220 nF input 50 50 REFOUT 100 nF 5 31 2 3 4
100 nF DEC
REFIN INN INP
TDA8793
MGR020
Fig.10 Application diagram for single-ended input mode with external reference.
2000 Nov 20
12
Philips Semiconductors
Product specification
8-bit, low-power, 3 V, 100 Msps Analog-to-Digital Converter (ADC)
TDA8793
handbook, full pagewidth
100 nF SND 100 nF 220 nF input 2 50 220 nF input 1 50 REFIN INN 32 2 3 DEC 31
TDA8793
INP 4 5
MGR021
REFOUT 100 nF
Fig.11 Application diagram for differential input mode with internal reference.
handbook, full pagewidth
100 nF SND 100 nF 220 nF input 100 REFIN INN 100 nF 100 INP REFOUT 100 nF
MGR022
DEC 31
32 2 3
1:1
TDA8793
4 5
Fig.12 Application diagram for differential input mode with internal reference and using a transformer.
2000 Nov 20
13
Philips Semiconductors
Product specification
8-bit, low-power, 3 V, 100 Msps Analog-to-Digital Converter (ADC)
PACKAGE OUTLINE LQFP32: plastic low profile quad flat package; 32 leads; body 5 x 5 x 1.4 mm
TDA8793
SOT401-1
c y X
24 25
17 16 ZE
A
e E HE wM bp 32 1 8 9 L detail X Lp A A2 A1 pin 1 index (A 3)
e bp D HD
ZD wM B
vM A
vM B
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.60 A1 0.15 0.05 A2 1.5 1.3 A3 0.25 bp 0.27 0.17 c 0.18 0.12 D (1) 5.1 4.9 E (1) 5.1 4.9 e 0.5 HD 7.15 6.85 HE 7.15 6.85 L 1.0 Lp 0.75 0.45 v 0.2 w 0.12 y 0.1 Z D (1) Z E (1) 0.95 0.55 0.95 0.55 7 0o
o
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT401-1 REFERENCES IEC 136E01 JEDEC MS-026 EIAJ EUROPEAN PROJECTION
ISSUE DATE 99-12-27 00-01-19
2000 Nov 20
14
Philips Semiconductors
Product specification
8-bit, low-power, 3 V, 100 Msps Analog-to-Digital Converter (ADC)
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 220 C for thick/large packages, and below 235 C for small/thin packages. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed.
TDA8793
If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
2000 Nov 20
15
Philips Semiconductors
Product specification
8-bit, low-power, 3 V, 100 Msps Analog-to-Digital Converter (ADC)
Suitability of surface mount IC packages for wave and reflow soldering methods
TDA8793
SOLDERING METHOD PACKAGE WAVE BGA, LFBGA, SQFP, TFBGA HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. not suitable not not not suitable(2) recommended(3)(4) recommended(5) suitable REFLOW(1) suitable suitable suitable suitable suitable
2000 Nov 20
16
Philips Semiconductors
Product specification
8-bit, low-power, 3 V, 100 Msps Analog-to-Digital Converter (ADC)
DATA SHEET STATUS DATA SHEET STATUS Objective specification PRODUCT STATUS Development DEFINITIONS (1)
TDA8793
This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
Preliminary specification
Qualification
Product specification
Production
Note 1. Please consult the most recently issued data sheet before initiating or completing a design. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2000 Nov 20
17
Philips Semiconductors
Product specification
8-bit, low-power, 3 V, 100 Msps Analog-to-Digital Converter (ADC)
NOTES
TDA8793
2000 Nov 20
18
Philips Semiconductors
Product specification
8-bit, low-power, 3 V, 100 Msps Analog-to-Digital Converter (ADC)
NOTES
TDA8793
2000 Nov 20
19
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW, Tel. +48 22 5710 000, Fax. +48 22 5710 001 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 5F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2451, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 60/14 MOO 11, Bangna Trad Road KM. 3, Bagna, BANGKOK 10260, Tel. +66 2 361 7910, Fax. +66 2 398 3447 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 3341 299, Fax.+381 11 3342 553
For all other countries apply to: Philips Semiconductors, Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 2000
Internet: http://www.semiconductors.philips.com
SCA 70
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
753504/03/pp20
Date of release: 2000
Nov 20
Document order number:
9397 750 07275

▲Up To Search▲

Price & Availability of TDA8793

	To Download TDA8793 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .